Pressure Sensitive Adhesive Compositions Comprising Polymerized Amide Monomers, Articles, and Methods

Abstract

Adhesive compositions are described comprising (e.g. polymerized units of) amide monomer selected from the group N consisting of i) CH2═CR4C(O)NHC(R1R1)(C(R1R1))nC(O)XR3; ii) CH2═CR4C(O)O(CH2)2NHC(O)NHR3; wherein n is an integer of 0 or 1; R1 is independently selected from hydrogen, alkyl, aryl, and alkylaryl having 1-10 carbon atoms; R3 is a group comprising 1-30 carbon atoms, R4 is H or CH3; and X is O or NH; and at least 50 wt. % of (e.g. polymerized units) of one or more other ethylenically unsaturated monomer(s).

Dependencies are inferred from the claim text.