Thermally conductive sheet
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsTakanori ITO, Akihiro ENDO
Life of this patent
Estimating the term…
Loading patent…
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsTakanori ITO, Akihiro ENDO
Estimating the term…
A thermally conductive sheet of a cured product of a silicone composition, including: (a) organopolysiloxane having 2 to 10 alkenyl groups only in a side chain; (b) organohydrogenpolysiloxane having hydrosilyl groups at both ends; (c) a thermally conductive filler; (d) a platinum-based curing catalyst; and (e) dimethylpolysiloxane having one end blocked with a trialcoxysilyl group, wherein the thermally conductive sheet has a hardness of 7 or less, maximum stress of 0.7 MPa or less when compressed by 50% at a compression speed of 3 mm/min, residual stress of 0.1 MPa or more, and a ratio of the max stress to the residual stress of 7/1 or less. This can provide a thermally conductive sheet with excellent thermal conductivity, a small difference between maximum stress and residual stress, and a suitable balance between compressibility and resilience, as a heat dissipation member for automotive components.
A thermally conductive sheet of a cured product of a silicone composition, comprising:
Dependencies are inferred from the claim text.