Curable polysiloxane composition with high thermal insulation performance at high temperature

Abstract

Provided is a curable polysiloxane composition comprising: (A) at least one organopolysiloxane having at least two alkenyl groups bonded to silicon per molecule in an amount of 100 parts by weight; (B) at least one organopolysiloxane having at least two hydrogen atoms bonded to silicon per molecule in an amount of from 0.5 to 20 parts by weight; (C) a hydrosilylation catalyst in a catalytic amount; (D) at least one flame retardant filler in an amount of from 2 to 150 parts by weight; and (E) water. Component (E) is dispersed as water droplets in a mixture of components (A), (B), (C) and (D), with an average droplet size of ≤100 μm. The composition has greatly increased thermal insulation performance at high temperature. A process for manufacturing a polysiloxane composite from the composition is also provided. The polysiloxane composite is useful as thermal insulation material and for thermal insulation.

Dependencies are inferred from the claim text.