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US 2026/0307883 A1Published application
Microwave heatable film, microwave heatable package, and method for producing microwave heatable film
AssigneeRicoh Company, Ltd.
InventorsTakaki Hayashi, Shohta Koide
Life of this patent
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Abstract
A microwave heatable film is provided that includes at least one first microwave heatable region having a first area, and one or more second microwave heatable regions each having a second area. The first area is larger than the second area in a plan view, and the first microwave heatable region and the second microwave heatable regions each have a surface resistivity of 5 Ω/sq to 10,000 Ω/sq.
Claims7
A microwave heatable film, comprising:
- at least one first microwave heatable region having a first area;
- and
- one or more second microwave heatable regions each having a second area,
- wherein:
- the first area is larger than the second area in a plan view;
- and
- the at least one first microwave heatable region and the one or more second microwave heatable regions each have a surface resistivity of 5 Ω/sq to 10,000 Ω/sq.
4 more elements
A method for producing a microwave heatable film, the method comprising:
- forming at least one first microwave heatable region having a first area on at least one side of a base material having a rectangular shape;
- and
- forming one or more second microwave heatable regions each having a second area near the at least one first microwave heatable region,
- wherein:
- the first area is larger than the second area in a plan view;
- and
- the at least one first microwave heatable region and the one or more second microwave heatable regions each have a surface resistivity of 5 Ω/sq to 10,000 Ω/sq.
4 more elements
Dependencies are inferred from the claim text.