Sensor having an active surface

An apparatus, comprising:

• a substrate having one or more substrate bond pads;
• a sensor over the substrate, the sensor comprising an active surface disposed between at least two sensor bond pads;
• a molding layer disposed over the substrate and covering at least one side of the sensor, the molding layer having a lower portion with a first molding height relative to a top surface of the substrate and an upper portion with a second molding height relative to the top surface of the substrate, the first molding height and the second molding height each being greater than a height of the active surface, the second molding height being great than the first molding height;
• and
• a lidding layer disposed over at least some of the lower portion of the molding layer and the active surface;
• wherein the lidding layer and the molding layer are configured to collectively form a space disposed above the active surface of the sensor, the space configured to define a flow channel.

A method, comprising:

• placing a sensor over a substrate, the sensor comprising an active surface disposed between at least two sensor bond pads, wherein the substrate comprises one or more substrate bond pads;
• forming a molding layer over the substrate that covers at least one side of the sensor, the molding layer having a lower portion with a first molding height relative to a top surface of the substrate and an upper portion with a second molding height relative to the top surface of the substrate, the first molding height and the second molding height each being greater than a height of the active surface, the second molding height being great than the first molding height;
• and
• placing a lidding layer over at least some of the lower portion of the molding layer and over the sensor surface to form a space over the active surface of the sensor, wherein the space defines a flow channel.

A method of using a flow cell, comprising:

• connecting the flow cell to a device, the flow cell comprising:
• a substrate having one or more substrate bond pads;
• a sensor over the substrate, the sensor comprising an active surface disposed between at least two sensor bond pads;
• a molding layer disposed over the substrate and covering at least one side of the sensor, the molding layer having a lower portion with a first molding height relative to a top surface of the substrate and an upper portion with a second molding height relative to the top surface of the substrate, the first molding height and the second molding height each being greater than a height of the active surface, the second molding height being great than the first molding height;
• and
• a lidding layer disposed over at least some of the lower portion of the molding layer and the active surface;
• wherein the lidding layer and the molding layer are configured to collectively form a space disposed above the active surface of the sensor, the space configured to define a flow channel;
• utilizing the active surface to perform a designated reaction in the flow cell, the utilizing comprising:
• delivering, via the flow channel, at least one reaction component to the active surface;
• and
• transmitting results of the designated reaction to the device.