Laminate and manufacturing method of laminate

Abstract

There are provided a laminate including a sealing layer including a member having a circuit and a sealing material; a re-distribution layer A in contact with one surface of the sealing layer and connected to the circuit of the member; and a re-distribution layer B in contact with the other surface of the sealing layer and not directly connected to the circuit of the member, in which the re-distribution layer A and the re-distribution layer B are formed to be electrically connectable to other members, the re-distribution layer A includes an insulating pattern A and a conductive pattern A existing between patterns of the insulating pattern A, the re-distribution layer B includes an insulating pattern B and a conductive pattern B existing between patterns of the insulating pattern B, and the insulating pattern A is formed of a composition having a mass reduction rate of 10% or less when a cured product obtained by curing the composition at 230° C. for 3 hours is held at 250° C. for 1 hour, and a manufacturing method of a laminate.

Dependencies are inferred from the claim text.