Circuit package structure with a conductive pillar and related conductive pillar
AssigneeChengdu Monolithic Power Systems Co., Ltd.
InventorsYanXin Wang, Xingguo Liu, Zhiqi Wang, Shenglin Zhang, Zheng Nie, Haifeng Li
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Abstract
This application discloses a circuit package structure with a conductive pillar. The circuit package structure includes a device layer and an inductive element layer. The conductive pillar provided in the device layer are coupled to the inductive element layer. The side wall of the conductive pillar is provided with cavity for accommodating encapsulating material, and the encapsulating material fills the space within the cavity.
Claims20
A circuit package structure with conductive pillar, comprising:
- a device layer, wherein a conductive pillar and a semiconductor power device chip embedded in an encapsulating material are disposed in the device layer;
- a top surface of the conductive pillar is exposed from the encapsulating material and coupled to a first coupling material, and a bottom surface of the conductive pillar is coupled to a second coupling material;
- an inductive element layer disposed on the device layer, wherein the inductive element layer includes a magnetic core material and a winding embedded in the magnetic core material, and end surfaces of the winding are exposed from the magnetic core material and coupled to the first coupling material;
- a side wall of the conductive pillar is provided with a cavity for containing the encapsulating material, and the encapsulating material is filled in the cavity.
A conductive pillar for a circuit package structure, comprising:
- a top surface and a bottom surface, wherein the conductive pillar is adapted to be embedded in an encapsulating material with the top surface of the conductive pillar exposed from the encapsulating material;
- a cavity for accommodating the encapsulating material disposed on a part of a side wall of the conductive pillar;
- wherein at a part of the side wall of the conductive pillar that is not provided with the cavity, at least one cross section obtained by cutting the conductive pillar along a plane parallel to the top surface is a first cross section;
- at the part of the side wall of the conductive pillar where the cavity is disposed, a cross section obtained by cutting the conductive pillar along a plane parallel to the top surface is a second cross section, and an area of the second cross section is less than an area of the first cross section.
A conductive pillar for a circuit package structure, comprising:
- a top surface and a bottom surface, wherein the conductive pillar is adapted to be embedded in an encapsulating material with the top surface of the conductive pillar exposed from the encapsulating material;
- a cavity for accommodating the encapsulating material, provided at a part of a side wall of the conductive pillar;
- wherein at a part of the side wall of the conductive pillar that provided with the cavity, an area of a cross section obtained by cutting the conductive pillar along a plane parallel to the top surface is less than an area of the top surface, and/or less than an area of the bottom surface.
Dependencies are inferred from the claim text.