Increased thermal conductivity of semi-damascene metal wiring

Abstract

A semiconductor interconnect structure and formation thereof. The semiconductor interconnect structure includes: a set of lower-level metal lines, the set of lower-level metal lines formed by subtractive etching; a thermal conductive layer formed above the set of lower-level metal lines; an interlayer dielectric layer surrounding sidewalls of the set of lower-level metal lines and the thermal conductive layer formed above the set of lower-level metal lines; a via formed above a first metal line in the set of lower-level metal lines; and a set of upper-level metal lines formed above the thermal conductive layer, where a thermal conductivity of the thermal conductive layer is greater than a thermal conductivity of the interlayer dielectric layer.

Dependencies are inferred from the claim text.