Semiconductor package and method for manufacturing the same

An electronic structure, comprising:

• a first substrate;
• a first conductive structure disposed over the first substrate and including a first test pad configured to be contacted by a probe during a testing process;
• and
• a second conductive structure disposed under the first substrate and including a second test pad configured to be contacted by a probe during a testing process, wherein an electrical path between the first conductive structure and the second conductive structure extends vertically between the first test pad and the second test pad.

A method of manufacturing an electronic device, the method comprising:

• forming a first conductive via in a first substrate and a first conductive structure on the first substrate, wherein the first conductive via is electrically connected to the first conductive structure, the first conductive structure defines a first opening to expose a first test pad thereof, and the first conductive via is disposed under the first test pad;
• testing the first test pad;
• and
• thinning the first substrate to expose the first conductive via.