Display module and preparation method therefor, and display device

Abstract

A display module includes a display substrate including a display area and a first bonding area and a second bonding area sequentially disposed on one side of the display area, wherein a bonding pad is disposed on the second bonding area; an integrated circuit chip bonded to the first bonding area, wherein the integrated circuit chip includes a first side edge on a side close to the bonding pad; a flexible circuit board bonded to the bonding pad of the second bonding area and covering the bonding pad, wherein through holes are formed in the flexible circuit board, and the through holes expose at least part of the first side edge; and a first protective layer, wherein at least part of the first protective layer is in direct contact with the first side edge exposed by the through holes.

Dependencies are inferred from the claim text.