Light-emitting diode circuit substrate
AssigneeCoretronic Corporation
InventorChun-Chi Hsu
Life of this patent
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Abstract
A light-emitting diode circuit substrate including multiple light-emitting diode chips, a redistribution structure, and multiple bonding pads is provided. The light-emitting diode chips include multiple contacts. The redistribution structure is disposed on the light-emitting diode chips and in direct contact with the plurality of contacts. The plurality of bonding pads are disposed on the redistribution structure and electrically connected to the plurality of contacts of the light-emitting diode chips via the redistribution structure. A manufacturing method of the light-emitting diode circuit substrate is also provided.
Claims5
A light-emitting diode (LED) circuit substrate, comprising:
- a plurality of LED chips comprising a plurality of contacts;
- a redistribution structure disposed on the plurality of LED chips and directly connected with the plurality of contacts;
- and
- a plurality of bonding pads disposed on the redistribution structure and electrically connected with the plurality of contacts of the plurality of LED chips via the redistribution structure.
Dependencies are inferred from the claim text.