Fabrication of gate-all-around integrated circuit structures having gate dielectrics with subtractively differentiated transition layer thickness
AssigneeIntel Corporation
InventorsPetr NOVOTNY, Durjoy DEV, Gianna DI FRANCESCO, Sriharsha KARUMURI, Daniel F. JARAMILLO CABANZO, Sayema CHOWDHURY, Aravind KILLAMPALLI, Chun-Kuo HUANG
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