Semiconductor device and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Ruei Jhan, Kuan-Ting Pan, Yu-Wei Lu, Shi-Ning Ju, Kuo-Cheng CHIANG, Chih-Hao WANG
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Ruei Jhan, Kuan-Ting Pan, Yu-Wei Lu, Shi-Ning Ju, Kuo-Cheng CHIANG, Chih-Hao WANG
Estimating the term…
Provided are a semiconductor device and a method of forming the same. The semiconductor device includes a semiconductor device. The semiconductor device includes a substrate including a plurality of fins, a plurality of semiconductor nanosheets stacked on the plurality of fins, a plurality of gate stacks wrapping the plurality of semiconductor nanosheets, an isolation structure around the plurality of fins, and a separator structure on the isolation structure to separate the plurality of gate stacks from each other. The separator structure includes a body and a cap on the body. The cap includes a first portion and a second portion. Sidewalls and bottom of the second portion is wrapped by the first portion.
A method of forming a semiconductor device, comprising:
A method of forming a semiconductor device, comprising:
A method of forming a semiconductor device, comprising:
Dependencies are inferred from the claim text.