Method of manufacturing three-dimensional ferroelectric memory devices
AssigneeSamsung Electronics Co., Ltd.
InventorsKyunghwan LEE, Yongseok KIM, Daewon HA
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AssigneeSamsung Electronics Co., Ltd.
InventorsKyunghwan LEE, Yongseok KIM, Daewon HA
Estimating the term…
A method of manufacturing a three-dimensional ferroelectric memory device, including forming a conductive pattern and a gate insulation pattern on a substrate, the conductive pattern and the gate insulation pattern being stacked in a horizontal direction substantially parallel to an upper surface of the substrate; forming a first source/drain pattern on the substrate adjacent to the gate insulation pattern; forming a channel on the first source/drain pattern, the channel extending in a vertical direction substantially perpendicular to the upper surface of the substrate, and the gate insulation pattern covering a sidewall of the channel; forming a second source/drain pattern at an upper portion of the channel; forming a ferroelectric pattern on a portion of an outer sidewall of the conductive pattern; and forming a gate electrode on the ferroelectric pattern.
A method of manufacturing a three-dimensional ferroelectric memory device, the method comprising:
A method of manufacturing a three-dimensional ferroelectric memory device, the method comprising:
A method of manufacturing a three-dimensional ferroelectric memory device, the method comprising:
Dependencies are inferred from the claim text.