Integrated circuit structures having both spine-fet and gaa architectures
AssigneeIntel Corporation
InventorsLeonard P. GULER, Andrew SHU, Nidhi KHANDELWAL, Prabhjot Kaur LUTHRA, Charles H. WALLACE
Life of this patent
Estimating the term…
Loading patent…
AssigneeIntel Corporation
InventorsLeonard P. GULER, Andrew SHU, Nidhi KHANDELWAL, Prabhjot Kaur LUTHRA, Charles H. WALLACE
Estimating the term…
Integrated circuit structures having both spine-FET and gate-all-around (GAA) architectures are described. In an example, a structure includes a dielectric backbone. A first vertical stack of nanowires is laterally adjacent to and in contact with a first side of the dielectric backbone. A first gate electrode is around the first vertical stack of nanowires. A second vertical stack of nanowires is laterally spaced apart from the first vertical stack of nanowires, the second vertical stack of nanowires free from a dielectric backbone. A second gate electrode is around the second vertical stack of nanowires.
An integrated circuit structure, comprising:
A static random access memory (SRAM) cell, comprising:
A computing device, comprising:
Dependencies are inferred from the claim text.