Heat dissipation assembly and terminal device

A terminal device comprising:

• a working element;
• and
• a heat dissipation assembly comprising:
• a base plate defining a groove and a through hole, the through hole communicating with the groove, the working element disposed on the base plate;
• a cover plate disposed in the groove and the through hole, the cover plate and the base plate cooperatively forming an accommodating groove, the accommodating groove comprising a first accommodating area and a second accommodating area, and the second accommodating area communicating with the first accommodating area and the through hole;
• a temperature sensor comprising a main body, a bending portion, and a probe, the bending portion connected to the main body and the probe, the main body disposed in the first accommodating area, the bending portion disposed in the second accommodating area, and the probe disposed in the through hole;
• and
• an encapsulating layer filled in the accommodating groove and fix to the temperature sensor.