US 2026/0302040 A1 · INDUCTOR PACKAGES WITH ADDED WIRE BONDS COUPLED TO CONDUCTIVE TRACES OF INDUCTOR COIL TO REDUCE RESISTANCE, AND RELATED FABRICATION METHODS

Abstract

Inductor packages with added wire bonds coupled to conductive traces of an inductor coil to reduce resistance, and related fabrication methods. Raised electrical bonds (e.g., wire bonds) are electrically coupled to or near opposite ends adjacent parallel metal traces to couple the adjacent parallel metal traces together in the form of conductive windings to form an inductor coil in the inductor package. To facilitate an effective reduced inductance without necessarily having to increase the size of the inductor coil and/or the inductor package, one or more additional wire bonds are additionally formed and each coupled to respective metal trace of the parallel metal traces. The additional wire bonds coupled to the metal traces reduces the resistance of the metal traces thus reducing the overall resistance of the inductor coil. This effectively reduces the resistance of the inductor in the inductor package.

Claims20

Dependent claims

An inductor package, comprising:

a substrate;
and
an inductor coil, comprising:
a plurality of metal traces on the substrate, the plurality of metal traces parallel to each other,
each metal trace of the plurality of metal traces comprising a first bonding section and a second bonding section;
and
a plurality of electrical bonds each comprising a raised wire, comprising:
a first end portion coupled to the second bonding section of a first metal trace of the plurality of metal traces;
and
a second end portion opposite the first end portion, the second end portion coupled to the first bonding section of a second metal trace of the plurality of metal traces adjacent to the first metal trace;
one or more additional wire bonds each coupled to a metal trace of the plurality of metal traces.

8 more elements

A method of fabricating an inductor package, comprising:

providing a substrate;
and
forming an inductor coil, comprising:
forming a plurality of metal traces on the substrate, the plurality of metal traces parallel to each other,
each metal trace of the plurality of metal traces comprising a first bonding section and a second bonding section;
and
forming one or more additional wire bonds each coupled to a metal trace of the plurality of metal traces;
and
forming a plurality of electrical bonds each comprising:
a first end portion;
a second end portion opposite the first end portion;
and
a raised wire coupled to the first end portion and the second end portion;
wherein forming the plurality of electrical bonds comprises, for each electrical bond of the plurality of electrical bonds:
coupling the first end portion to the second bonding section of a first metal trace of the plurality of metal traces;
extending the raised wire above the first metal trace;
and
coupling the second end portion to the first bonding section of a second metal trace of the plurality of metal traces adjacent to the first metal trace.

15 more elements

Dependencies are inferred from the claim text.

Inductor packages with added wire bonds coupled to conductive traces of inductor coil to reduce resistance, and related fabrication methods

Life of this patent

Inductor packages with added wire bonds coupled to conductive traces of inductor coil to reduce resistance, and related fabrication methods

Life of this patent

Abstract

Claims20