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US 2026/0301776 A1Published application
Memory device
AssigneeSK hynix Inc.
InventorHeon Yong CHANG
Life of this patent
Estimating the term…
Abstract
A memory device may include a substrate including a cell region and a peripheral region, a conductive layer disposed over the substrate, and located in the peripheral region, a first capping insulating layer over the conductive layer, a contact plug contacting an upper surface of the conductive layer, and a wiring layer contacting an upper surface of the contact plug. A distance from the upper surface of the contact plug to the conductive layer is less than a distance from an upper surface of the first capping insulating layer to the conductive layer.
Claims20
A memory device comprising:
- a substrate including a cell region and a peripheral region;
- a conductive layer disposed over the substrate, and located in the peripheral region;
- a first capping insulating layer over the conductive layer;
- a contact plug contacting an upper surface of the conductive layer, a distance from an upper surface of the contact plug to the conductive layer being less than a distance from an upper surface of the first capping insulating layer to the conductive layer;
- and
- a wiring layer contacting the upper surface of the contact plug.
3 more elements
A memory device comprising:
- a substrate including a cell region and a peripheral region;
- a conductive layer disposed over the substrate, and located in the peripheral region;
- a contact plug contacting an upper surface of the conductive layer;
- and
- a wiring layer including a first wiring section and a second wiring section, the first wiring section contacting an upper surface of the contact plug and including a lower surface that has substantially the same width as the upper surface of the contact plug, the second wiring section being integrally formed with the first wiring section and including a lower surface that has a width greater than an upper surface of the first wiring section.
2 more elements
A memory device comprising:
- a substrate;
- a conductive layer over the substrate;
- a first insulating layer on the conductive layer;
- a first capping insulating layer on the first insulating layer;
- a contact plug contacting an upper surface of the conductive layer, passing through the first insulating layer, and including an upper surface that is located between an upper surface of the first capping insulating layer and an upper surface of the first insulating layer;
- and
- a wiring layer including a first wiring section and a second wiring section, the first wiring section contacting the upper surface of the contact plug and including a lower surface having substantially the same width as the upper surface of the contact plug, the second wiring section being integrally formed with the first wiring section and including a lower surface that has a width greater than an upper surface of the first wiring section.
4 more elements
Dependencies are inferred from the claim text.