US 2026/0299567 A1 · STOCHASTIC FAILURE PREDICTION MODELS AND THEIR USE IN OPTICAL PROXIMITY CORRECTION AND MASK VALIDATION

Abstract

Adjustments to edges in an integrated circuit layout are made during optical proximity correction based on trained stochastic failure prediction models. The stochastic failure prediction models generate average edge placement errors and standard deviations of edge placements for as-manufactured features that correspond to an edge in an integrated circuit layout. A defect rate model calibrated for a particular integrated circuit manufacturing process generates a predicted defect rate for a layout geometry based on information generated by the stochastic failure prediction models. Optical proximity correction can utilize multiple stochastic failure prediction models that model multiple defect modes to determine which edges of an integrated circuit layout are to be adjusted in a photomask layout to reduce the defect rate. The stochastic failure prediction models can also be used during mask validation to identify regions of the photomask layout that are predicted to have high defect rates.

Claims20

Dependent claims

A method comprising:

determining a predicted defect rate for a layout geometry of an integrated circuit layout, wherein determining the predicted defect rate is based on a defect rate model and a stochastic failure prediction model;
determining that a position of an edge of a polygon in the layout geometry is to be adjusted in a photomask layout based on the predicted defect rate for the layout geometry, wherein the photomask layout is based on the integrated circuit layout;
and
generating information representing the photomask layout, wherein a position of the edge in the layout geometry in the photomask layout is adjusted relative to the position of the edge in the layout geometry in the integrated circuit layout.

1 more element

A method comprising:

determining a first predicted defect rate for a layout geometry of an integrated circuit layout, wherein determining the first predicted defect rate is based on a defect rate model and a stochastic failure prediction model, wherein the first predicted defect rate is based on a dimension of the layout geometry, the dimension is associated with an edge of a polygon of the layout geometry, and the edge is located at a first position in the layout geometry;
determining a second predicted defect rate for the layout geometry, wherein determining the second predicted defect rate is based on the defect rate model and the stochastic failure prediction model, and the edge is located at a second position in the layout geometry;
and
generating information representing a photomask layout, wherein the photomask layout is based on the integrated circuit layout and the edge is located at the second position in the layout geometry in the photomask layout if the second predicted defect rate is less than the first predicted defect rate.

1 more element

One or more computer-readable storage media storing computer-executable instructions that, when executed, cause a computing system to:

determine a predicted defect rate for a dimension of a layout geometry of an integrated circuit layout, wherein determining the predicted defect rate is based on a defect rate model and a stochastic failure prediction model;
determine that a position of an edge in the layout geometry is to be adjusted in a photomask layout based on the predicted defect rate for the dimension, wherein the photomask layout is based on the integrated circuit layout;
and
generate information representing the photomask layout, wherein a position of the edge in the photomask layout is adjusted relative to the position of the edge in the layout geometry.

1 more element

Dependencies are inferred from the claim text.

Stochastic failure prediction models and their use in optical proximity correction and mask validation

Life of this patent

Stochastic failure prediction models and their use in optical proximity correction and mask validation

Life of this patent

Abstract

Claims20