Processing apparatus and method for optimizing heat dissipation in heat dissipation member

A processing apparatus for optimizing heat dissipation of heat dissipation member, the processing apparatus comprising:

• a memory configured to store a plurality of instructions, a plurality of virtual sample models corresponding to a plurality of sample circuit boards, a simulation parameter of the plurality of sample circuit boards, a virtual test model to corresponding to a test circuit board, and a component parameter of the test circuit board, wherein a labelled region on each of the virtual sample models has a virtual heat dissipation member, the labelled region indicating an optimal heat dissipation region of a physical heat dissipation member coated or arranged on the corresponding sample circuit board;
• and
• a processor connected to the memory and configured to run a neural network model and access the plurality of instructions to perform following actions:
• action a) generating a plurality of labelled temperatures on each of the virtual sample models according to the simulation parameter;
• action b) training the neural network model by using the simulation parameter, the plurality of virtual sample models, all of the labelled temperatures, and all of the labelled regions;
• and
• action c) using the trained neural network model to generate a plurality of predicted temperatures and a predicted region on the virtual test model based on the component parameter and the virtual test model,
• wherein the plurality of predicted temperatures indicate respective temperatures of a plurality of locations on the test circuit board, and the predicted region indicates an optimal heat dissipation region on the test circuit board to coat or arrange the physical heat dissipation member.