Photomask and method of manufacturing or repairing photomask
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Ming HSU, Ming-Wei TSAI
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Ming HSU, Ming-Wei TSAI
Estimating the term…
An embodiment method of manufacturing a photomask includes depositing a first lower insulation portion of a first insulation structure over a substrate in a vertical direction and forming a first light blocking structure over the first lower insulation portion in the vertical direction, where the first lower insulation portion is between the first light blocking structure and the substrate. The method further includes depositing a first upper insulation portion of the first insulation structure covering at least an upper surface of the first light blocking structure. The first insulation structure and the first light blocking structure constitute a first mask pattern structure. One or more characteristics of the first light blocking structure, the first lower insulation portion, and the first upper insulation portion are configured such that an overall light transmittance of the first mask pattern structure along the vertical direction ranges from 3% to 10%.
A method of manufacturing a photomask, the method comprising:
A photomask, comprising:
A method of repairing a photomask, the method comprising:
Dependencies are inferred from the claim text.