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US 2026/0299304 A1Published application
Method to improve display efficiency and uniformity of ar waveguide
AssigneeApplied Materials, Inc.
InventorsJinxin FU, Ludovic GODET
Life of this patent
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Abstract
Optical devices, such as augmented reality waveguide combiners, having an index-matched layer with an engineered thickness distribution are provided. The engineered thickness distribution modifies the optical path through the substrate to adjust phase and optical interference. By adjusting the thickness distribution, the optical path of light is modulated to direct the light to the output coupling grating.
Claims20
An optical device, comprising:
- a substrate, the substrate having a substrate thickness distribution defined by a top surface of the substrate and a bottom surface of the substrate, wherein the substrate thickness distribution varies along a first length parallel to the top surface and a second length perpendicular to the first length;
- an index-matched layer disposed on the bottom surface of the substrate, the index-matched layer having an engineered thickness distribution defined by an exterior surface of the index-matched layer and the bottom surface of the substrate, wherein the engineered thickness distribution varies along the first length and the second length perpendicular to the first length;
- a plurality of optical device structures formed on the top surface of the substrate;
- a low index layer disposed over the plurality of optical device structures;
- and
- an anti-reflective layer disposed over the exterior surface of the index-matched layer.
3 more elements
An optical device, comprising:
- a substrate having a top surface and a bottom surface opposite the top surface;
- a plurality of optical device structures disposed on the top surface of the substrate;
- and
- an index-matched layer disposed on the bottom surface of the substrate, the index-matched layer having an engineered thickness distribution that varies along a first direction parallel to the top surface and a second direction perpendicular to the first direction,
- wherein the engineered thickness distribution is configured to modify an optical path of light propagating through the substrate.
2 more elements
A method of forming a design thickness distribution in an optical device, comprising:
- measuring a substrate thickness distribution of a substrate defined by a distance between a top surface of the substrate and a bottom surface of the substrate along a first length parallel to the top surface and a second length perpendicular to the first length;
- disposing an index-matched layer on the bottom surface of the substrate;
- and
- etching the index-matched layer to have an engineered thickness distribution to form a design thickness distribution, wherein the design thickness distribution is defined by the engineered thickness distribution and the substrate thickness distribution, wherein the design thickness distribution varies along the first length and the second length.
1 more element
Dependencies are inferred from the claim text.