Integrated optical assembly

A unified packaging structure, comprising:

• a base;
• a high-speed electrical interface and a low-speed electrical interface that are both formed from a first set of layers;
• multiple sidewalls that are formed from a second set of layers;
• and
• a lid, wherein:
• one or more high-speed components and one or more low-speed components are attached to the first set of layers,
• the base, the multiple sidewalls, and the lid form one or more optical sub-assembly (OSA) structures that enclose one or more optical chips,
• the one or more optical chips are electrically connected to the first set of layers via first a set of electrical interconnects, and
• the first set of layers providing a second set of electrical interconnects through the multiple sidewalls of the OSA structure to the one or more optical chips.

An integrated optical assembly, comprising:

• a first set of layers comprising a printed circuit board (PCB) structure;
• a second set of layers comprising multiple sidewalls of an optical sub-assembly (OSA) structure;
• and
• one or more optical chips enclosed within the multiple sidewalls of the OSA structure, wherein:
• the one or more optical chips are electrically connected to the PCB structure via a first set of electrical interconnects, and
• the PCB structure providing a second set of electrical interconnects through the multiple sidewalls of the OSA structure to the one or more optical chips.