Optoelectronic wafer bonding structure and bonding method, chip package structure and package method

An optoelectronic wafer bonding method, comprising:

• providing a photonic integrated circuit wafer, wherein the photonic integrated circuit wafer comprises a plurality of photonic integrated circuit chips, each photonic integrated circuit chip has a first area, a second area, and a third area arranged in sequence along a first direction, the first area is provided with a conductive structure, and the second area is provided with a waveguide extending along the first direction;
• forming a trench in the third area, and a sidewall of the trench exposes the waveguide;
• providing an electronic integrated circuit chip and bonding a lower surface of the electronic integrated circuit chip to an upper surface of one of the photonic integrated circuit chips on the photonic integrated circuit wafer, wherein the electronic integrated circuit chip is electrically connected to the conductive structure;
• arranging a reflective structure within the trench, wherein a light emitted from the waveguide is reflected by the reflective structure and then emitted along a second direction, wherein the second direction is perpendicular to the first direction;
• and
• filling the trench with a light-transmitting material to form a light-transmitting layer covering the reflective structure, wherein the light emitted from the waveguide is reflected by the reflective structure and then emitted along the second direction, and propagates in the light-transmitting layer.