Production method for an optoelectronic element and corresponding optoelectronic element

Abstract

A production method for an optoelectronic element and a corresponding optoelectronic element. The production method includes: providing a first wafer substrate having a first front side and a first rear side, wherein a plurality of optical metamaterial components is provided in or on the first wafer substrate; providing a second wafer substrate having a second front side and a second rear side, wherein a plurality of optical signal-processing components is provided in or on the second wafer substrate; wafer bonding the first rear side to the second front side in such a way that at least one associated optical metamaterial component is optically functionally assigned to each optical signal-processing component; and singulating the bonded first wafer substrate and second wafer substrate into a plurality of chips of optoelectronic elements, which in each case have an optical signal-processing component and at least one associated optical metamaterial component.

Dependencies are inferred from the claim text.