Bond pull test system in wire bonding of semiconductor package using machine learning and test method thereof

Abstract

A method of testing the tensile strength of a bonding wire included in a semiconductor package is disclosed. The method of testing a tensile strength of a bonding wire included in a disclosed semiconductor package includes: collecting data related to the tensile strength of the bonding wire; consolidating the collected data into a unified database; generating a machine learning model using the unified database, the model configured to determine a tensile strength value of the bonding wire; receiving a tensile strength parameter associated with the bonding wire; predicting a tensile strength value corresponding to the tensile strength parameter using the machine learning model; and determining whether the bonding wire is abnormal based on the predicted strength value.

Dependencies are inferred from the claim text.