Sensor arrangement and method for manufacturing a plurality of sensor arrangements
AssigneeTDK Electronics Co., Ltd.
InventorsChristian Wohlgemuth, Stefan Kuschel, Thomas Stendel, Benjamin Bohl, Sven Röhrbein
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Abstract
In an embodiment a sensor arrangement includes a core component including a pressure sensor element, a circuit carrier, and a support element, and an upper housing element surrounding the core component, wherein the upper housing element abuts an upper side of the support element, wherein the circuit carrier has a central region and a peripheral region surrounding the central region, and wherein the support element is arranged in the central region of the circuit carrier and on an upper side of the circuit carrier.
Claims19
-17. (canceled)
A sensor arrangement comprising:
- a core component comprising a pressure sensor element, a circuit carrier, and a support element;
- and
- an upper housing element surrounding the core component,
- wherein the upper housing element abuts an upper side of the support element,
- wherein the circuit carrier comprises a central region and a peripheral region surrounding the central region, and
- wherein the support element is arranged in the central region of the circuit carrier and on an upper side of the circuit carrier.
Dependencies are inferred from the claim text.