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US 2026/0298440 A1Published application
Integrated ceiling device with mechanical arrangement for a light source
AssigneeLighting Defense Group, LLC
InventorDaniel S. SPIRO
Life of this patent
Estimating the term…
Abstract
An integrated ceiling device includes integrated ceiling device including an electronic device housing, a heat dissipating structure, a light source, and a reflection/refraction assembly. An air gap is defined between the electronics housing and other components allowing ambient air to flow therethrough for cooling.
Claims20
An electromechanical arrangement comprising:
- an electronic device housing that retains at least one driver that generates heat when energized, the electronic device housing is scalable to expand horizontally and/or vertically;
- a heat dissipating structure, the electronic device housing, at least in part, extends above the heat dissipating structure, the heat dissipating structure has a central opening;
- a light source that generates heat when energized and is coupled to a floor facing surface of the heat dissipating structure, the light source is configured to receive power via the device housing;
- and
- a support arm that is coupled to the heat dissipating structure and the electronic device to maintain an air gap therebetween, central vertical axes of the heat dissipating structure and the electronic device housing are substantially coaligned so that the air gap exposes exterior surfaces of the heat dissipating structure and the electronic device housing to surrounding air, wherein
- upon the electromechanical arrangement being energized, heat generated by the driver and the light source induces a free flow of air to traverse across and between the external surfaces of the heat dissipating structure and the electronic device housing to cool the electromechanical arrangement.
3 more elements
An electromechanical arrangement comprising:
- an electronic device housing that retains at least one driver, upon being energized the at least one driver generates heat, the electronic device housing is scalable to expand horizontally and/or vertically;
- a heat dissipating structure, the electronic device housing is positioned at least in part within the heat dissipating structure, the heat dissipating structure has a central opening;
- a light source that generates heat when energized and is coupled to a floor facing surface of the heat dissipating structure, the light source is configured to receive power via the device housing;
- and
- a support arm that is coupled to the heat dissipating structure and the electronic device to maintain an air gap therebetween, central vertical axes of the heat dissipating structure and the electronic device housing are substantially coaligned so that the air gap exposes exterior surfaces of the heat dissipating structure and the electronic device housing to surrounding air, wherein
- upon the electromechanical arrangement being energized, heat generated by the driver and the light source induces a free flow of air to traverse across and between the external surfaces of the heat dissipating structure and the electronic device housing to cool the electromechanical arrangement.
3 more elements
Dependencies are inferred from the claim text.