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US 2026/0297786 A1Published application
Nickel electroplating bath and method of using the same
OwnerCourtney Duff, Eric Yakobson +1inventors
InventorsCourtney Duff, Eric Yakobson, Wenbo Shao
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Abstract
A nickel electroplating bath and a method of using the same to deposit nickel onto a substrate. The nickel deposit exhibits low co-planarity and bump height uniformity. The nickel electroplating bath comprises (a) a source of nickel ions; (b) a conducting salt; (c) a first plating additive; (d) a second plating additive; and (e) at least one of one or more nickel anode corrosion additives, one or more surfactants, and one or more pH buffers.
Claims17
A nickel electroplating bath comprising:
- a. a source of nickel ions;
- b. a conducting salt;
- c. a first plating additive;
- d. a second plating additive, and
- e. at least one of one or more nickel anode corrosion additives, one or more surfactants, and one or more pH buffers;
- wherein the nickel electroplating bath contains less than 1 ppm of any ingredient that would result in a nickel deposit that does not exhibit low co-planarity or hump height uniformity, and
- wherein the nickel electroplating bath is configured to deposit nickel exhibiting low co-planarity and bump height uniformity.
4 more elements
A nickel electroplating bath consisting essentially of:
- a. about 10 to about 35 g/L nickel ions;
- b. about 20 to about 500 g/L of a conducting salt;
- c. about 20 mg/L to about 2 g/L of a first plating additive comprising a Class 1 brightener;
- d. about 0.2 to about 15 g/L of a second plating additive comprising an alkene sulfonate;
- e. at least one of one or more nickel anode corrosion additives, one or more surfactants, and one or more pH buffers;
- and
- f. balance water.
4 more elements
Dependencies are inferred from the claim text.