Implantable medical device with curable liquid feedthrough potting adhesive
OwnerYangbin Cheninventor
Life of this patent
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Abstract
An implantable medical device with a curable liquid feedthrough potting adhesive, and methods of making the same are provided. The curable liquid feedthrough potting adhesive is capable of curing within 3 hours at an ambient temperature of 70° C. or less and may have a pot life of at least 60 hours. The curable liquid feedthrough potting adhesive bonds a feedthrough pin within a feedthrough ferrule of the implantable medical device. The curable liquid feedthrough potting adhesive includes an epoxy resin, a thiol hardener, and a solid amine catalyst.
Claims20
A curable liquid feedthrough potting adhesive suitable for use in a feedthrough ferrule of an implantable medical device, capable of curing within 3 hours at an ambient temperature of 70° C. or less, and with a pot life of at least 6 hours, the curable liquid feedthrough potting adhesive comprising:
- an epoxy resin comprising one or more of a glycidyl ether group, an alkoxysilane group, and a nano silica;
- a thiol hardener comprising two or more thiol groups, an alkoxysilane group, or two or more thiol groups and an alkoxysilane group;
- and
- a solid catalyst comprising an amine group.
An implantable medical device feedthrough assembly comprising:
- a feedthrough ferrule;
- and
- a curable feedthrough potting adhesive disposed on the feedthrough ferrule, wherein the curable feedthrough potting adhesive is capable of curing within 3 hours at an ambient temperature of 70° C. or less, and with a pot life of at least 6 hours, the curable liquid feedthrough potting adhesive comprising:
- an epoxy resin comprising one or more of a glycidyl ether group, an alkoxysilane group, and a nano silica;
- a thiol hardener comprising two or more thiol groups, an alkoxysilane group, or two or more thiol groups and an alkoxysilane group;
- and
- a solid catalyst comprising an amine group.
A method for forming an implantable medical device, the method comprising:
- providing a ferrule defining a via and a feedthrough pin positioned within the via of the ferrule,
- depositing a curable liquid feedthrough potting adhesive adjacent to and in contact with both the feedthrough pin and the ferrule, the curable liquid feedthrough potting adhesive comprising:
- (i) an epoxy resin comprising one or more of a glycidyl ether group, an alkoxysilane group, and a nano silica;
- (ii) a thiol hardener comprising at least two thiol groups, an alkoxysilane group, or at least two thiol groups and an alkoxysilane group;
- and
- (iii) a solid catalyst comprising an amine group,
- wherein the curable feedthrough potting adhesive is capable of curing within 3 hours at an ambient temperature of 70° C. or less, and with a pot life of at least 6 hours;
- and
- curing the curable liquid feedthrough potting adhesive to form a reaction product bonded to both the feedthrough pin and the ferrule.
Dependencies are inferred from the claim text.