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US 2026/0297301 A1Published application
Polysiloxane filler treating agent and composition prepared therewith
AssigneesDow Global Technologies LLC, Dow Silicones Corporation, Rohm and Haas Company
InventorsHai Wang, Matthew Carter, Hongyun Xu, Dan Zhao, Elena C. Montoto Blanco, Tzu-Chi Kuo, Eric Joffre
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Abstract
The present invention relates to a composition comprising: a) a polyorganosiloxane; b) filler particles; and c) a filler treating agent of Formula I: Formula I where R1, R2, m, n, p, and q are as defined herein. The composition is useful as a thermally conductive formulation.
Claims10
A composition comprising:
- a) a polyorganosiloxane;
- b) filler particles;
- and
- c) a filler treating agent of Formula I:
- where m is from 5 to 150;
- n is from 1 to 3;
- p is from 0 to 3;
- q is from 0 to 8;
- each R1 is independently C1-C6-alkyl, vinyl, phenyl, or benzyl;
- each R1′ is independently C1-C6-alkyl;
- R2 is:
- where r is from 0 to 5;
- s is 0 or 1;
- t is from 0 to 15;
- each R3 is independently C1-C6-alkyl;
- a is an integer of 1 to 3;
- wherein the polyorganosiloxane has degree of polymerization in the range of from 40 to 800.
14 more elements
Dependencies are inferred from the claim text.