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US 2026/0297249 A1Published application
Accelerated peroxide-cured resin compositions having extended open times
AssigneeArkema Inc.
InventorsLisa B. RACHWAL, Evan CROCKER, Marina DESPOTOPOULOU, Leonard H. PALYS
Life of this patent
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Abstract
Curable resin compositions having extended open limes al ambient temperatures find short cure times at elevated temperatures are prepared using a curable resin winch is curable with one or more liquid organic peroxides or a blend thereof and an accelerator/activator promoter comprising a metal salt and a thiol-functionalized organic compound.
Claims22
A curable resin composition comprising:
- a) at least one curable resin which is capable of being cured by liquid organic peroxide;
- b) at least one room-temperature-stable organic peroxide which is in liquid form at 25° C. and has a one-hour half-life temperature of 100° C. or more;
- c) optionally at least one non-room-temperature-stable organic peroxide which is in liquid form at 10° C. or less, and has a one-hour half-life temperature of less than 100° C.;
- d) at least one salt of at least one metal comprising at least one of Li, Al, Mg, Co, Fe, Cu, Zn, Ni, Mn, Cr, Sn, Au, Pd, or Pt;
- e) at least one thiol-functionalized organic compound;
- and
- f) optionally at least one solvent comprising at least one of alcohols, glycols, or glycol ethers.
4 more elements
(canceled)
-15. (canceled)
A method of preparing a cured composition, the method comprising:
- combining:
- a) at least one curable resin which is capable of being cured by an organic peroxide;
- b) at least one room-temperature-stable organic peroxide which is in liquid form at 25° C. and has a 1 hour half-life temperature of 100° C. or more;
- c) optionally at least one non-room-temperature-stable organic peroxide which is in liquid form at 10° C. or less and has a one-hour half-life temperature of less than 100° C.,
- d) at least one salt of at least one metal comprising at least one of Li, Al, Mg, Co, Fe, Cu, Zn, Ni, Mn, Cr, Sn, Au, Pd, or Pt;
- e) at least one thiol-functionalized organic compound;
- and
- f) optionally at least one solvent comprising at least one of alcohols, glycols, or glycol ethers;
- to provide a curable resin composition;
- and
- heating the curable resin composition to a temperature effective to initiate curing of the curable resin composition.
8 more elements
A curing system comprising:
- i) a first component comprising:
- at least one room-temperature-stable organic peroxide which is in liquid form at 25° C. and has a one-hour half-life temperature of 100° C. or more;
- and
- at least one non-room-temperature-stable organic peroxide which is in liquid form at 10° C. or less and has a one-hour half-life temperature of less than 100° C.;
- wherein said first component optionally is substantially devoid of styrene, and
- ii) a second component comprising:
- at least one salt of at least one metal comprising at least one of Li, Al, Mg, Co, Fe, Cu, Zn, Ni, Mn, Cr, Sn, Au, Pd, or Pt;
- at least one thiol-functionalized organic compound;
- and
- optionally at least one solvent comprising at least one of alcohols, glycols, or glycol ethers.
7 more elements
-37. (canceled)
Dependencies are inferred from the claim text.