Processing system and method for processing ultra-thin glass, and ultra-thin glass carrier assembly

Abstract

A processing system, an ultra-thin glass carrier assembly, and a method for processing an ultra-thin glass (UTG) substrate are disclosed. The system includes a laser processing module and a controller configured to control laser processing to extend beyond the UTG substrate to remove at least a portion of a reversible adhesive layer, thereby forming a through-hole having a bottom surface suitable for downstream processing without requiring additional adhesive removal steps. The ultra-thin glass carrier assembly includes a temporary carrier substrate, a reversible adhesive layer, and a UTG substrate with a through-hole extending through the UTG substrate and the reversible adhesive layer, and the bottom surface of the through-hole can expose the temporary carrier substrate. The method includes bonding the UTG substrate to a carrier, performing laser processing, and controlling the laser to penetrate beyond the UTG substrate to remove adhesive, enabling reliable metallization and other downstream processing.

Dependencies are inferred from the claim text.