Liquid ejection device
AssigneeBrother Kogyo Kabushiki Kaisha
InventorKazuya SEKO
Life of this patent
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Abstract
A liquid ejection device includes an ejection head having a nozzle plate with a plurality of nozzles configured to eject liquid, an actuator configured to eject liquid through the nozzles, and a head drive unit configured to drive the actuator. The device further includes a substrate having a surface extending in a direction intersecting the nozzle plate, and one or more electronic components mounted on the substrate surface and configured to control the head drive unit. A cooling mechanism is provided to cool the ejection head. A supporting body is thermally coupled to and supports the ejection head. The supporting body includes a first surface facing the substrate surface in the intersecting direction, and one or more contact parts that are thermally connected to the electronic components.
Claims13
A liquid ejection device comprising:
- an ejection head including a nozzle plate having a plurality of nozzles, a plurality of actuators, and a head drive unit configured to drive the plurality of actuators to eject the liquid from the plurality of nozzles;
- a substrate having a substrate surface extending in a direction intersecting the nozzle plate;
- one or more electronic components mounted on a substrate surface, the electronic components being configured to control the head drive unit;
- a cooling mechanism configured to cool the ejection head;
- and
- a supporting body configure to support the ejection head,
- wherein the supporting head thermally contacts the ejection head,
- wherein the supporting body includes a first surface, the first surface facing the substrate surface, the first surface extending in the intersecting direction, and
- wherein one or more contact parts thermally contact the one or more electronic components.
A liquid ejection device comprising:
- an ejection head including a nozzle plate having a plurality of nozzles configured to eject liquid, an actuator, and a head drive unit configured to drive the actuator to eject the liquid from the nozzles;
- a substrate having a substrate surface extending in a direction intersecting the nozzle plate;
- one or more electronic components disposed on the substrate surface, the electronic components being configured to control the head drive unit;
- a cooling mechanism configured to cool the ejection head;
- and
- a thermal coupling and heat-transfer structure configured to transfer heat generated by the electronic components to the ejection head, which is cooled by the cooling mechanism.
Dependencies are inferred from the claim text.