Bonding device and bonding method

A lamination device, comprising:

• a laminating mechanism, comprising a laminating mold, wherein the laminating mold has an outwardly-convex laminating surface, the laminating surface is configured to be laminated with a first to-be-laminated film to be fixed, and a shape of the laminating surface is matched with a shape of the first to-be-laminated film;
• a support mechanism, comprising a support table and a flexible laminating pad, wherein the flexible laminating pad is located on a side of the support table facing the laminating mechanism, the flexible laminating pad has a support surface, a shape of the support surface is matched with a shape of the first to-be-laminated film, and a curvature of the support surface is greater than a curvature of the first to-be-laminated film;
• and
• a carrier mechanism, comprising a carrier film and a clamping fixture, wherein the carrier film is located between the laminating surface and the support surface, a side of the carrier film facing the laminating surface is configured to attach a second to-be-laminated film, and the clamping fixture is clamped at an edge of the carrier film.