Substrate processing apparatus and substrate processing method using the same

A substrate processing method, the method comprising:

• introducing a substrate into a substrate processing apparatus;
• raising a pressure inside the substrate processing apparatus;
• and
• drying the substrate,
• wherein the drying of the substrate comprises spraying a cleaning agent from a discharge nozzle of the substrate processing apparatus,
• wherein the spraying of the cleaning agent from the discharge nozzle comprises:
• changing a pressure of a spray space of the discharge nozzle;
• and
• opening an elastic hole of an elastic portion of the discharge nozzle by changing the pressure of the spray space.

A substrate processing method, the method comprising:

• introducing a substrate into a substrate processing apparatus;
• injecting pressurized gas into the substrate processing apparatus to increase a pressure inside the substrate processing apparatus;
• and
• drying the substrate after injecting the pressurized gas,
• wherein the substrate processing apparatus comprises:
• a process chamber including a process space;
• a stage configured to support the substrate;
• a heater configured to increase a temperature of the process space;
• a pressurizing pump configured to increase a pressure in the process space;
• and
• a cleaning agent discharger configured to spray a cleaning agent into the process space,
• wherein the cleaning agent discharger is on the stage and comprises a discharge nozzle,
• wherein the drying of the substrate comprises:
• increasing the temperature of the process space using the heater;
• spraying the cleaning agent from the discharge nozzle after increasing the temperature of the process space;
• and
• injecting inert gas into the process space after spraying the cleaning agent, and
• wherein the discharge nozzle comprises:
• a discharge body including a spray space;
• a piezoelectric element;
• and
• an elastic portion including an elastic hole.