Back to results
US 2026/0293534 A1Published application
Superconducting hard-stops for flip chip
AssigneeIQM Finland Oy
InventorsMario PALMA, Máté JENEI, Jean-Luc ORGIAZZI, Hasnain AHMAD, Kuan TAN
Life of this patent
Estimating the term…
Abstract
The invention relates to the field of integrated circuit device fabrication, in particular to the fabrication of superconducting hard stops for flip chip devices. Superconducting hard stops are formed on a first substrate and are used to constrain the position of a second substrate relative to the first substrate.
Claims16
A method of fabricating a superconducting integrated circuit device, the method comprising:
- fabricating one or more superconducting qubits in a base layer on a first substrate;
- forming a first resist over the base layer, the first resist comprising a plurality of first openings, each of the first openings exposing a different area of the base layer;
- forming a seed layer over the first resist, the base layer and the first substrate such that the seed layer is in direct contact with the base layer within the first openings;
- forming a second resist over the seed layer, the second resist comprising a plurality of second openings, each of the second openings exposing an area on the seed layer, wherein the second openings are positioned above the first openings;
- depositing a superconducting hard stop on each exposed area of the seed layer by electroplating;
- removing the first resist, second resist and seed layer except for areas of the seed layer between the superconducting hard stop and the base layer;
- and
- forming a flip chip package by positioning a second substrate opposite the first substrate such that the second substrate or components thereon are in contact with the plurality of superconducting hard stops, wherein the position of the second substrate relative to the first substrate is constrained by the superconducting hard stops.
5 more elements
A flip chip package comprising:
- one or more superconducting qubits in a base layer on a first substrate;
- a plurality of superconducting hard stops formed on the base layer;
- a second substrate positioned opposite the first substrate, wherein the second substrate or components thereon are in contact with the plurality of superconducting hard stops such that the position of the second substrate relative to the first substrate is constrained by the superconducting hard stops.
Dependencies are inferred from the claim text.