Electronic apparatus and method for manufacturing the same
AssigneeSamsung Display Co., Ltd.
InventorsJAEYOUNG JANG, YUNOH NAM, CHANHEE PARK
Life of this patent
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Abstract
An electronic apparatus includes: a display module divided into a first region including a pixel, a second region bent with respect to a virtual axis extending in a first direction, and a third region where a driving chip electrically connected to the pixel is mounted, a flexible circuit board disposed in at least a portion of the third region of the display module and connected to the display module, and a cover layer which covers the driving chip. A depression portion corresponding to the driving chip is defined in a surface of the cover layer facing the driving chip.
Claims20
An electronic apparatus comprising:
- a display module divided into a first region including a pixel, a second region bent with respect to a virtual axis extending in a first direction, and a third region where a driving chip electrically connected to the pixel is mounted;
- a flexible circuit board disposed in at least a portion of the third region of the display module and connected to the display module;
- and
- a cover layer configured to cover the driving chip,
- wherein a depression portion corresponding to the driving chip is defined in a surface of the cover layer facing the driving chip.
A method for manufacturing an electronic apparatus, the method comprising:
- forming a display module, which is divided into a first region including a pixel, a second region bent with respect to a virtual axis extending in a first direction, and a third region where a driving chip electrically connected to the pixel is mounted;
- forming a flexible circuit board electrically connected to the display module on one side of the third region of the display module;
- disposing the flexible circuit board on a rear surface of the display module by bending the second region;
- and
- disposing, on the driving chip, a cover layer which covers the driving chip,
- wherein a depression portion corresponding to the driving chip is defined in a surface of the cover layer facing the driving chip.
Dependencies are inferred from the claim text.