Semiconductor package and method for producing semiconductor package
AssigneeSony Semiconductor Solutions Corporation
InventorHIROHITO MIYAZAKI
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Abstract
To reduce the number of components of a mounting substrate in an electronic device including a semiconductor package having a cavity structure. The semiconductor package includes a semiconductor substrate, a first semiconductor chip, and a first component. In this semiconductor package, a frame portion is formed around a predetermined region in one surface of two surfaces of the semiconductor substrate when viewed from a direction perpendicular to the one surface. The first semiconductor chip is mounted on the predetermined region. The first component is mounted on a surface of the frame portion formed on the semiconductor substrate.
Claims16
A semiconductor package comprising:
- a semiconductor substrate in which a frame portion is formed around a predetermined region in one surface of two surfaces when viewed from a direction perpendicular to the one surface;
- a first semiconductor chip mounted in the predetermined region;
- and
- a first component mounted on a surface of the frame portion.
A producing method for a semiconductor package, comprising:
- a substrate producing procedure of preparing a semiconductor substrate in which a frame portion is formed around a predetermined region in one surface of two surfaces when viewed from a direction perpendicular to the one surface;
- and
- a component mounting procedure of mounting a first component on a surface of the frame portion.
Dependencies are inferred from the claim text.