Semiconductor device and memory device
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei YAMAZAKI, Ryota HODO, Toshiya ENDO
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AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei YAMAZAKI, Ryota HODO, Toshiya ENDO
Estimating the term…
A semiconductor device that can be miniaturized or highly integrated is to be provided. The semiconductor device includes a first conductor and a second conductor that are over an oxide and separated from each other; a third conductor in contact with a part of a top surface of the first conductor; a fourth conductor in contact with a part of a top surface of the second conductor; a first insulator that is positioned over the third conductor and the fourth conductor and has an opening overlapping with a region between the third conductor and the fourth conductor; a second insulator that is positioned in the opening of the first insulator and in contact with another part of the top surface of the first conductor, another part of the top surface of the second conductor, a side surface of the third conductor, and a side surface of the fourth conductor; a third insulator that is in contact with a top surface of the oxide, a side surface of the first conductor, a side surface of the second conductor, and a side surface of the second insulator; and a fifth conductor that is positioned over the third insulator. A distance between the first conductor and the second conductor is smaller than a distance between the third conductor and the fourth conductor. The second insulator includes a first layer and a second layer over the first layer. The first layer includes a nitride insulator, and the second layer includes an oxide insulator.
A semiconductor device comprising:
Dependencies are inferred from the claim text.