Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsRyutaro ISHIZAKI, Takuya YAMADA, Nao MIYAGI, Masaaki FURUKAWA, Hiroki WAKIMOTO, Yoshihiro IKURA, Tatsuya NAITO
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AssigneeFuji Electric Co., Ltd.
InventorsRyutaro ISHIZAKI, Takuya YAMADA, Nao MIYAGI, Masaaki FURUKAWA, Hiroki WAKIMOTO, Yoshihiro IKURA, Tatsuya NAITO
Estimating the term…
Provided is a semiconductor device comprising a semiconductor substrate, trench portions, mesa portions, an emitter electrode, and an interlayer dielectric film with a contact hole formed therein, wherein the mesa portions include a channel mesa portion having a first conductivity type emitter region on an upper surface of the semiconductor substrate and a second conductivity type base region between the emitter region and the drift region, and connected to the emitter electrode by the contact hole; and a floating mesa portion with no contact hole above or in which a length of the contact hole above is shorter than that of the contact hole above the channel mesa portion, and at a lower end of at least one of the trench portions sandwiching the channel mesa portion, a second conductivity type second trench bottom region having a higher concentration than the base region is provided.
A semiconductor device comprising:
Dependencies are inferred from the claim text.