Semiconductor device and semiconductor memory
AssigneeKioxia Corporation
InventorsHiroyuki Kutsukake, Kazuma Yonezu
Life of this patent
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Abstract
A semiconductor device according to one embodiment includes first and second transistors that share one end. The semiconductor device includes a substrate, first and second insulating films, first and second conductive layers, and first, second and third contact plugs. The substrate includes first and second impurity diffusion regions. A first silicide part is formed on the second impurity diffusion region. A second silicide portion is formed on the first conductive layer except a part of the first conductive layer. A third silicide portion is formed on the second conductive layer. In plan view, the part of the first conductive layer is disposed between the first silicide part and the second silicide part.
Claims15
A semiconductor device comprising a first transistor and a second transistor that share one end, the semiconductor device comprising:
- a substrate including a first impurity diffusion region and a second impurity diffusion region, the first impurity diffusion region corresponding to the one end of the first transistor and the second transistor, the second impurity diffusion region having a higher impurity concentration than the first impurity diffusion region in the first impurity diffusion region, wherein a first silicide part is formed on the second impurity diffusion region;
- a first insulating film and a second insulating film provided in a first direction on the substrate, the first insulating film corresponding to a gate insulating film of the first transistor, and the second insulating film corresponding to a gate insulating film of the second transistor;
- a first conductive layer provided on the first insulating film and corresponding to a gate electrode of the first transistor, wherein a second silicide portion is formed on the first conductive layer except a part of the first conductive layer;
- a second conductive layer provided on the second insulating film and corresponding to a gate electrode of the second transistor, wherein a third silicide portion is formed on the second conductive layer;
- and
- a first contact plug, a second contact plug, and a third contact plug respectively coupled to the first silicide part, the second silicide part, and the third silicide part, wherein
- in plan view, the part of the first conductive layer is disposed between the first silicide part and the second silicide part.
Dependencies are inferred from the claim text.