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US 2026/0293110 A1Published application
Semiconductor device and method for fabricating the same
AssigneeSK hynix Inc.
InventorsGwang Il JO, Sung Bin KIM
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Abstract
A semiconductor device and a method of manufacturing the semiconductor device are provided. The semiconductor device includes: a semiconductor substrate; neighboring bit line structures spaced apart from each other over the semiconductor substrate; at least one contact pad formed in the semiconductor substrate between the neighboring bit line structures and having a bottom surface which is lower than a bottom surface of the neighboring bit line structures; and a storage node contact, disposed over the at least one contact pad, contacting the at least one contact pad.
Claims12
A semiconductor device, comprising:
- a semiconductor substrate;
- neighboring bit line structures spaced apart from each other over the semiconductor substrate;
- at least one contact pad formed in the semiconductor substrate between the neighboring bit line structures and having a bottom surface which is lower than a bottom surface of the neighboring bit line structures;
- and
- a storage node contact, disposed over the at least one contact pad, contacting the at least one contact pad.
2 more elements
Dependencies are inferred from the claim text.