Cooling system for power electronics
AssigneeCarrier Corporation
InventorsArindom Joardar, Tobias Sienel
Life of this patent
Estimating the term…
Abstract
A cooling system for cooling one or more heat-generating devices includes a heat sink to which the one or more heat-generating devices are thermally coupled and a heat exchanger thermally coupled to the heat sink. The heat exchanger has a first flow path for receiving a primary cooling fluid and a second flow path for receiving a secondary cooling fluid. Heat is transferable to the primary cooling fluid from both the heat sink and the secondary cooling fluid at the heat exchanger.
Claims20
A cooling system for cooling one or more heat-generating devices, comprising:
- a heat sink to which the one or more heat-generating devices are thermally coupled, the heat sink including a housing and a fluid circuit formed in the housing and through which a heat transfer fluid circulates;
- and
- a heat exchanger thermally coupled to the heat sink.
A method of cooling at least one heat-generating device, the method comprising:
- transferring heat from the at least one heat-generating device to a heat sink, wherein a fluid circuit is formed in the heat sink and a heat transfer fluid circulates therethrough;
- and
- transferring heat from the heat sink to at least one cooling fluid at a heat exchanger thermally coupled to the heat sink.
Dependencies are inferred from the claim text.