Novel integrated power module

A multi-phase power supply module, comprising:

• a plurality of output voltage nodes;
• an inductor including a plurality of inductor packs;
• a first printed circuit board (PCB) provided orthogonal to the inductor at a first surface of the inductor,
• wherein the first PCB includes a first surface and a second surface;
• a plurality of power chips provided on the first surface of the first PCB, wherein the plurality of power chips are coupled to the plurality of inductors to provide a plurality of output voltages at the plurality of output voltage nodes;
• a second PCB provided orthogonal to the inductor at a second surface of the inductor via an inductor platform,
• a plurality of output capacitors arranged on a first surface of the second PCB,
• wherein at least some of the plurality of output capacitors are provided underneath the inductor, between the second surface of the inductor and the first surface of the second PCB, and
• wherein the plurality of output capacitors are coupled to the plurality of voltage nodes.

A method, comprising:

• providing an inductor;
• providing a first printed circuit board (PCB) orthogonal to the inductor at a first surface of the inductor;
• providing a second PCB orthogonal to the inductor at a second surface of the inductor via an inductor platform,
• wherein the second surface of the inductor is opposite to the first surface of the inductor;
• providing the second PCB with a plurality of output capacitors on a first surface of the second PCB;
• and
• providing at least some of the plurality of output capacitors underneath the inductor, between the second surface of the inductor and the first surface of the second PCB.