A method for manufacturing an optical transmission device comprising the steps of:
- disposing an optical semiconductor device on a sub-mount, the optical semiconductor device including a semiconductor laser formed above a semiconductor substrate, an optical modulation element formed above the semiconductor substrate, an electrostatic discharge withstand element formed above the semiconductor substrate, and a temporary electrode electrically connecting the optical modulation element and the electrostatic discharge withstand element in parallel;
- connecting electrically the optical semiconductor device and a drive circuit;
- and
- cutting electrically the temporary electrode of the optical semiconductor device disposed on the sub-mount.