Radio frequency device packages

An integrated device package, comprising:

• an antenna structure at least partially embedded in a top layer;
• a via extending at least partially through a thickness of the top layer;
• a carrier comprising one or more routing traces and electrically coupled to the antenna structure through a standing bond wire of an interconnect structure and the via;
• an integrated device die mounted on the carrier and disposed between the carrier and at least a portion of the antenna structure, the integrated device die electrically coupled to the one or more routing traces of the carrier;
• and
• an encapsulant material disposed between the carrier and the at least a portion of the antenna structure, the integrated device die at least partially embedded in the encapsulant material, the interconnect structure at least partially embedded in the encapsulant material,
• wherein the at least a portion of the antenna structure is formed on a surface of the encapsulant material, and the standing bond wire comprises a first portion in contact with the carrier and a second portion extending non-parallel to a surface of the carrier to which the integrated device die is mounted, the first portion having a first width wider than a second width of the second portion.