Cleaning method and plasma processing apparatus
AssigneeTokyo Electron Limited
InventorsTakafumi NOGAMI, Yoshiki NAKANO, Kenichi KOTE
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Abstract
A cleaning method includes supplying a cleaning gas into a processing chamber from a plurality of first gas nozzles provided through a top plate and each having a first nozzle diameter, supplying a diluent gas into the processing chamber from a plurality of second gas nozzles provided through the top plate and each having a second nozzle diameter larger than the first nozzle diameter, generating plasma from the cleaning gas and the diluent gas supplied into the processing chamber; and performing cleaning by exposing an interior of the processing chamber to the plasma.
Claims11
A cleaning method comprising:
- supplying a cleaning gas into a processing chamber from a plurality of first gas nozzles provided through a top plate and each having a first nozzle diameter;
- supplying a diluent gas into the processing chamber from a plurality of second gas nozzles provided through the top plate and each having a second nozzle diameter larger than the first nozzle diameter;
- generating plasma from the cleaning gas and the diluent gas supplied into the processing chamber;
- and
- performing cleaning by exposing an interior of the processing chamber to the plasma.
A plasma processing apparatus comprising:
- a processing chamber including a top plate;
- a first gas nozzle provided through the top plate and configured to supply a cleaning gas into the processing chamber;
- a second gas nozzle provided through the top plate and configured to supply a diluent gas into the processing chamber;
- and
- a plasma source configured to generate plasma from the cleaning gas and the diluent gas supplied into the processing chamber, wherein
- the first gas nozzle has a first nozzle diameter, and
- the second gas nozzle has a second nozzle diameter larger than the first nozzle diameter.
Dependencies are inferred from the claim text.