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US 2026/0289764 A1Published application
Method for measuring deformation level of chip and method for stacking semiconductor chips
AssigneeNextin, Inc.
InventorsTae Hoon PARK, Junhee JEONG
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Abstract
Provided is a method for measuring a z-axis deformation level of a chip from a two-dimensional image of the chip, the method including: acquiring the two-dimensional image of the chip by scanning a surface of the chip; extracting a feature of the surface of the chip from the two-dimensional image; and measuring the z-axis deformation level of the chip based on the extracted feature.
Claims11
A method for measuring a deformation level of a chip, the method comprising:
- acquiring a two-dimensional image of the chip by scanning a surface of the chip;
- extracting a feature of the surface of the chip from the two-dimensional image;
- and
- measuring a z-axis deformation level of the chip based on the extracted feature.
1 more element
A device for measuring a deformation level of a chip, the device comprising:
- an image acquisition unit acquiring a two-dimensional image of the chip by scanning a surface of the chip;
- a feature extraction unit extracting a feature of the surface of the chip from the two-dimensional image;
- and
- a deformation calculation unit calculating a z-axis deformation level of the chip by using the extracted feature.
1 more element
Dependencies are inferred from the claim text.