Multi-chip electro-photonic networks and photonic memory fabrics for interconnecting multiple circuit packages
AssigneeCelestial AI Inc.
InventorsDavid LAZOVSKY, Philip WINTERBOTTOM, Martinus BOS
Life of this patent
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Abstract
Multi-chip electro-photonic networks for interconnecting multiple circuit packages via photonic channels. Examples of a computing system include a first circuit package, a second circuit package, and one or more inter-chip bidirectional photonic channels interconnecting the first and second circuit packages. The first circuit package can include one or more memory nodes. The second circuit package can include multiple compute nodes and intra-chip bidirectional photonic channels interconnecting the compute nodes.
Claims21
(canceled)
A system, comprising:
- a photonic integrated circuit (PIC) comprising a waveguide and an optical modulator associated with an optical link, the optical modulator being configured to impart a message onto an optical signal in the waveguide;
- and
- an electronic integrated circuit (EIC) mounted on the PIC, the EIC comprising a transmit unit for sending the message from the EIC and a credit register, wherein the transmit unit comprises:
- a driver electrically connected to the optical modulator, the driver configured to apply an electronic drive signal to the optical modulator to impart the message onto the optical signal;
- and
- a serializer configured to convert the message received as parallel data into the electronic drive signal for driving the optical modulator;
- and
- wherein the EIC is configured to stall transmission over the optical link when a number of credit tokens in the credit register is exceeded by a number of credit tokens associated with the message.
A method for managing message transmission over an optical link, the method comprising:
- maintaining a count of available credit tokens in a credit register;
- receiving a message as parallel data;
- comparing a number of credit tokens required for the message to the count of available credit tokens in the credit register;
- stalling transmission of the message over the optical link when the number of credit tokens required for the message exceeds the count of available credit tokens;
- converting the parallel data into an electronic drive signal via a serializer;
- and
- applying the electronic drive signal to an optical modulator associated with the optical link to impart the message onto an optical signal.
A system, comprising:
- a photonic integrated circuit (PIC) comprising a waveguide and an optical modulator associated with an optical link, the optical modulator being configured to impart a message onto an optical signal in the waveguide;
- and
- an electronic integrated circuit (EIC) mounted on the PIC, the EIC comprising a transmit unit for sending the message from the EIC and a credit register, wherein the transmit unit comprises:
- a driver electrically connected to the optical modulator, the driver configured to apply an electronic drive signal to the optical modulator to impart the message onto the optical signal;
- and
- a serializer configured to convert the message received as parallel data into the electronic drive signal for driving the optical modulator;
- and
- wherein the EIC is configured to control transmission of the message over the optical link based on a number of credit tokens in the credit register and information in the message.
Dependencies are inferred from the claim text.